MicroPower Global Files Three New Key Patents To Further Strengthen IP Position

(September 23rd 2020) – Hamilton, Bermuda – MicroPower Global Limited today announced that the Company has filed three new provisional patents with the US Patent and Trademark Office (USPTO) covering the critical business areas of module fabrication and device longevity.

The specific topics covered include structure, process, and novel equipment design:

  1. Intermediate temperature contact structure and process to produce
  2. High temperature contact structure, process to produce, and equipment design associated with process
  3. Module assembly contact materials and process to produce

All provisional patents are scheduled to be split upon final filing within approximately 12 months and will also be internationalized, potentially resulting in an additional 60-100 enforceable patent filings worldwide.

Max Lewinsohn, MicroPower’s Chairman, said, “The filing of these three new patent applications is a very important milestone and the culmination of years of painstaking R&D behind “closed doors” by our technical team based in Texas. This work has been guided by our CTO Dr Tom Zirkle, and places MicroPower in a very strong and valuable position for the long-term future, as we move towards full commercialization.”